• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    In order to create a device with which a plurality of, preferably horizontally stored substrates, in particular wafers or test wafers, as they occur above all in the manufacture of electronic components, can be stored and possibly transported with the smallest possible distance from one another, a device is proposed which has a plurality of storage elements (10) following one another in a stacking direction, each of which is provided for receiving at least one substrate, the storage elements (10) each being provided with means for supporting the substrates, the storage elements (10) here having a stacking area which is provided for arranging the respective storage element within a stack (12 ') of storage elements (10), and furthermore the storage elements (10) can be stacked directly on top of one another.
    公开号:CH717426B1
    申请号:CH00237/04
    申请日:2004-02-16
    公开日:2021-11-15
    发明作者:Rudy Federici；Blattner Jakob
    申请人:Tec Sem Ag；
    IPC主号:
    专利说明:

    The present invention relates to a device for storing plate-shaped substrates as specified in the introductory part of claim 1.
    Electronic components are usually produced from approximately circular semiconductor disks, so-called wafers. These substrates have to be fed to various process systems in which the substrates are essentially treated surfaces. In this context, it is often necessary to temporarily store the substrates if, after the processing in one processing system has been completed, the substrates cannot be fed to another processing system immediately afterwards. It is customary to temporarily store the substrates in a storage device under clean room conditions (hereinafter referred to as “clean room conditions”). Since the costs of creating clean room conditions are essentially dependent on the size of the room, the aim is generally to store the substrates with the smallest possible distance from one another.
    Despite the smallest possible distance from one another, it is often necessary to be able to remove certain individual wafers from the storage device without removing other substrates. The distance between successive substrates within such storage devices is therefore limited by the fact that there is still an access distance into which a gripper can be inserted in order to grasp and remove the corresponding substrate.
    So-called test wafers are used in order to be able to optimize processing operations. As a rule, no electronic components are manufactured from such test wafers. They only serve to empirically optimize process parameters by processing test wafers with different process parameters and then using measurements to determine which values of the process parameters are used for the wafers actually to be processed. In addition to the wafers mentioned, test wafers of this type are also another important field of application for the present invention.
    Furthermore, it may be necessary to transport wafers inside or outside a factory in a container. For this purpose, too, transport containers are used which have a plurality of storage elements, on each of which a substrate can generally be arranged. Such transport containers are often standardized, for example as so-called FOUP transport boxes. Here, too, there is a need to be able to arrange the substrates with the smallest possible spacing from one another.
    The invention is therefore based on the object of creating a device with which a plurality of, preferably horizontally stored substrates can be stored with the smallest possible distance from one another and, if necessary, transported. At least in preferred further developments, it should also be possible to create clean room conditions within the device in the simplest possible way. According to a further aspect of the invention, a tool is to be provided with which substrates can be removed from the device despite their minimal distance from one another. Yet another aspect of the invention relates to a method according to claim 10.
    The object is achieved by a device as reproduced in claim 1. It is particularly advantageous here if between a plurality, preferably between all of the storage elements that follow one another, their respective spacing can be changed from a storage spacing to an access spacing that is enlarged for this purpose. As a result, in the storage state, the smallest possible so-called pitch spacing can be achieved between successive storage elements and thus also substrates. The storage distance is essentially only limited by a minimum distance which should be maintained in order to ensure that the surfaces of the substrates do not touch. With the invention, therefore, very highly compressed storage of wafers or other plate-shaped substrates is possible. Nevertheless, the invention enables the advantage of being able to individually access each of the substrates contained in the closed storage.
    In a preferred embodiment of the invention, their distance from one another can be changed for access purposes in all of the existing successive bearing elements. This means that each substrate stored in the device can be accessed individually. The distance is preferably increased parallel to the stacking direction of the storage elements. In principle, devices according to the invention can be structurally designed to store substrates in a horizontal or in a vertical orientation or in any orientations in between.
    In connection with the invention, it may be useful to achieve the relative movement required to increase the distance between two successive storage elements in that the upper storage elements are raised in a horizontal alignment of the substrates. Depending on the storage distances between the storage elements, it may be necessary to lift some or all of the storage elements located above them at the same time.
    In another embodiment, the increase in the bearing distance towards the access distance is achieved in that the lower of the two storage elements to be separated from one another is moved downwards. Here, too, it may be necessary to move some or all of the storage elements following the lower of the two storage elements (between which an access distance is to be achieved) downward as well.
    Finally, in a further alternative embodiment, the lower of the two storage elements to be spaced apart from one another can be moved downward and the upper storage element can be moved upward. In connection with the invention, a large number of variants of relative movements are conceivable in order to separate storage elements from one another and to enable access to a storage area from at least one of the storage elements.
    A particularly advantageous embodiment according to the invention can be achieved by mounting elements that are arranged directly on top of one another. The storage elements can be closed in a ring shape and each have a plurality of supports, on each of which a substrate can be arranged. The supports can, for example, be angled upwards with respect to the at least approximately round rings and have support surfaces for supporting a substrate.
    This also makes it possible to form the housing of the device by the storage elements themselves. Clean room conditions can be created and maintained within the housing. With such a configuration, an additional housing that would otherwise be required can be avoided. Furthermore, the problem of an otherwise likewise necessary access opening in the housing and the positioning of the substrate to be removed or inserted in front of the access opening can be avoided in a favorable manner. Nevertheless, in certain embodiments of the invention it can also be expedient to arrange a housing around the storage elements which can be provided with an insertion / removal opening for substrates and / or storage elements.
    It is particularly preferred here if the storage elements can be individually removed from or inserted into the stack of storage elements. Particular advantages can be achieved if a storage element can be removed or inserted at any point in the stack without having to move other storage elements beforehand or afterwards for this purpose. This can be used, for example, to exchange a storage element for another storage element, to transport a substrate together with its storage element, or also to reduce or enlarge a stack. As a result, the storage capacity can also be adapted to the respective conditions with very little effort. In order to achieve this, it can be useful if the storage elements can be stacked on top of one another without having a detachable or non-detachable connection to one another.
    With such a solution there is also the possibility of removing a substrate together with its storage element from the stack and transporting it within a process plant or a factory. This allows the number of necessary contacts between handling devices and the respective substrate itself to be reduced considerably. Such contacts always involve the risk that the respective substrate will be damaged.
    In order to seal the housing to the outside, bearing rings can be provided with sealing elements which then seal a possible gap between the bearing elements when they occupy the intended bearing spacing from one another. The advantageous encapsulation of the device from the outside that can be achieved in this way can also be achieved by other sealing means.
    [0017] The tower or stack formed by a large number of storage elements arranged one above the other can tend towards instability, in particular when generating an access distance between two storage elements. To avoid this, the device can be provided with stabilizing elements. Such stabilizing elements can be centering elements, for example, which are attached to the bearing elements and precisely align the bearing elements with respect to one another. Another possibility are lateral guide elements which are arranged on the outside next to the bearing elements and which prevent the tower from tipping over.
    According to a further aspect of the invention, it can also be used to form a transport container with which a plurality of substrates can be transported simultaneously in a comparatively small space. Due to the above-mentioned properties of the invention, transport containers of this type according to the invention can be realized with the same transport capacity, much more compact transport containers than the FOUP boxes already mentioned at the beginning.
    The extremely high-density storage of the substrates achievable with the invention is particularly advantageous in connection with transport devices that are provided for transport outside a factory, since the costs and the technical effort for transport increase with the size of the transport container. However, the use of such compact transport containers, which have the same dimensions as before and have a significantly higher holding capacity for substrates, can also be of great advantage within a factory. In this context, a transport container can also be advantageous in which only one storage element with its substrate can be accommodated. A storage element can in particular be provided as part of a transport container for transport within a factory on a conveyor belt or some other conveyor device.
    [0020] Further advantageous refinements emerge from the claims, the description and the drawing.
    The invention is explained in more detail with reference to the exemplary embodiments shown purely schematically in the figures; 1 shows a view of a device according to the invention from the side; FIG. 2 shows a detailed illustration from FIG. 1; FIG. FIG. 3 shows a detailed illustration from FIG. 1 from above; FIG. 4 shows an illustration of the device according to FIG. 1 from above; 5 a-d show a sequence of the opening of the device for removing or classifying a wafer; 6 shows a schematic sequence drawing with elements of the device according to the invention and a tool; 7 shows an overall view of a device according to a preferred embodiment of the invention; 8 shows a detailed representation of the device according to the invention according to the exemplary embodiment according to FIG. 7; FIG. 9 shows a perspective detailed illustration according to FIG. 8; 10 shows an illustration of the installed device according to FIG. 7 from above; FIG. 12 shows a detailed illustration according to FIG. 10; 13 shows a perspective illustration of a bearing element according to the exemplary embodiment according to FIG. 7; 14 shows a view from above of the bearing element according to FIG. 13; FIG. 15 is a side view of the mounting element according to FIG. 13; FIG. 16 shows a detailed illustration according to FIG. 15 with a wafer disk placed thereon; FIG. 17 shows a representation of the guide elements from above according to the embodiment according to FIG. 7; 18 shows a perspective illustration according to FIG. 17; 19 shows a side view according to FIG. 17; 20-23 shows a sequence of lifting the upper bearing rings, exposing the bearing element to be machined and holding down the bearing elements underneath with the tool (in each case without the bearing rings being shown); 24-28 the process of lifting the upper storage elements, exposing the storage element to be machined and holding down the storage elements underneath with the tool (each with a representation of the storage elements); 29 shows a further exemplary embodiment of the device according to the invention including the tool, in a perspective illustration; FIG. 30 shows a stack from FIG. 29 with storage elements according to the invention; FIG. 31, 32 show two different states during a separation of storage elements for access; 33 shows a perspective illustration of a stack in an access state; 34 shows a perspective detailed illustration of a storage element with a wafer arranged thereon; 35 shows a transport container according to the invention.
    In a device shown in Fig. 1, a stack 12 of storage elements designed as storage rings 10 is arranged, which rests at the bottom (not shown). With the exception of the lowermost storage ring, each storage ring 10 rests with a stacking area directly on the storage ring 10 arranged below it. The stack 12 is flowed through from above with a clean air system 20 with a clean air stream directed downwards in such a way that a clean room is formed in the closed state. In the open state shown, the flow of clean air is used to maintain a dust- and particle-free environment within the device.
    A handling device 32 can be controlled via a control panel 30, with which the stack of storage rings can be selectively opened. In the exemplary embodiment shown here, this is done using a tool 50 that is matched to the stack 12 of the device.
    In the storage rings 10 - as shown in Fig. 3 - three holding elements 16 (supports) are arranged on which a disc-shaped wafer 40 can be stored.
    The mounting elements 16 are angled slightly upwards and point inwards (with respect to the storage rings 10). They each have a flat, slightly downwardly inclined support surface and thus form a storage location for a wafer 40.
    In Fig. 2, the open state of the bearing rings 10 is shown. In this case, all of the storage rings above that storage ring to which access is provided are raised by a certain amount. This creates an access space. However, the storage rings 10 - and thus also the wafers - are packed so tightly that the intended wafer cannot yet easily be reached under, since it is at a very small distance from the next lower wafer. For this reason, the storage ring following the lifted partial stack 12 'downwards - subsequently or simultaneously - is also raised by a certain amount. This lifting height can correspond, for example, to the height at which the wafers 40 are spaced upwardly from the annular part of the storage ring by the angled holding elements 16. As a result of this measure, each wafer is easily accessible despite the high packing density when the device is in storage. As shown in FIG. 4, the corresponding wafer 40 can be fed to a further handling operation or process after it has been removed by an automatic handling device.
    In Figs. 5a to 5d, the opening process described above is shown in detail. The tool 50, which has two lifting surfaces 52 and 54, is moved towards the stack 12 of storage rings at a certain azimuthal position and then grips with the upper lifting surface under the storage ring 10a. The storage ring 10a is then moved upwards by a certain distance until the lower lifting surface engages the storage ring 10b. Then the lower bearing ring 10b is raised again by a certain distance, with all the bearing rings above it being raised further. In this position, the wafer, which rests on the storage ring 10b, can be accessed free of elements of the device or other wafers, as can be seen from FIG. 5d. This wafer can now be removed by the gripper 60. In order to insert a wafer into the device and place it on the storage ring 10b, the procedure in principle is the same with regard to the creation of an access space for the storage ring 10b.
    In the embodiment shown, the tool 50 can be rotated around the stack 12 of the storage elements 10 in order to be able to assume any desired position on the circumference of the stack. In another embodiment, however, it is also possible that the stack 12 is rotated or moved in some other way and the tool is fixed in relation to its position on the circumference of the stack or can only be rotated through a small pivot angle.
    In the embodiment according to the invention shown here, the stack 12 of the storage rings 10 is stabilized in that its position is held on the outside by three vertical rods not shown in detail. This prevents the stack 12 from tilting. Alternatively, at least one guide pin can be passed vertically through the storage elements.
    As shown in Fig. 6, the projections 14 on the storage rings 10 are offset from one another in a step-like manner, so that the projection of the higher storage ring, for example, clockwise - azimuthally (in the circumferential direction) is offset by a little more than the width of the projection . The measure is related to the configuration of the tool 50 of this exemplary embodiment, in which the lower lifting surface 52 is offset to the left with respect to the upper lifting surface 54 by a little more than a projection width.
    In a preferred embodiment according to FIGS. 7-28, the lateral guides are arranged in such a way that engagement in the stack is made possible not only for removing and reinserting wafers 40, but also for exchanging storage rings 10. For this purpose, guide elements 80 that are far apart from one another are arranged on both sides of the bearing rings 10, which allow the bearing rings 10 to be pulled out horizontally. These guide elements 80 are provided with rolling or sliding elements in the exemplary embodiment. With such a device, it is possible that maintenance work can be carried out on the system even while it is in operation, without the entire system having to be taken out of operation. Maintenance work can consist, for example, in replacing or removing storage elements or providing the stack with additional storage elements.
    In this embodiment, use is made of the aforementioned spreading solution. The tool of the device engages in each of three bearing rings, that is to say also in the bearing ring 10c, which is arranged below the bearing ring 10b. This bearing ring 10c is kept at its level, so that the tension, e.g. caused by the pressure of the arrangement, cannot lead to an independent lifting of the bearing rings that remain below when the load is released.
    Finally, embodiments are also possible in which the substrates are not stored in this way or not at all compressed on storage elements, for example in the so-called “1/1 pitch” provided as a standard. This makes it possible to access a substrate without changing a distance to one or more adjacent storage elements. Nevertheless, in such an arrangement, the above-described spreading to prevent the independent lifting of the storage elements below can be quite useful.
    In order to be able to vary the degree of compression in a particularly simple manner, an intermediate ring, not shown in the figures, can be arranged between two successive bearing rings, against which the two respective bearing rings bear. The distance between successive substrates within the storage device can be varied via the height of the storage rings. Despite this possibility of variation, the same storage elements can always be used. This possible embodiment according to the invention also shows that, in connection with the invention, the mounting elements do not necessarily have to follow one another directly.
    In the device shown in Fig. 29, a plurality of stacks 12 of storage rings 10 are provided. In the illustration of FIG. 29, the individual storage rings are not shown as such, but only their entirety in the form of the respective stack 12. On each stack 12 there is an upper end cover 110 which, for example, can sit on the uppermost storage ring (see also FIG Fig. 30). Each of the stacks 12 can also be arranged with its respective lower storage ring on a lower base plate 111. The storage elements as well as the base plate 111 and the end cover 110 form an essentially closed container as a whole.
    Each of the base plates 111 is attached to an axis which can be moved in the Z direction (i.e. vertically), whereby all the bearing rings 10 can be moved directly between two arms 112 which are stationary in the Z direction. Each of the two arms 112 contains opening tools 114, which will be discussed in greater detail below, with which the respective stack 12 can be opened at any point for access to a specific substrate or a specific storage ring 10. In another embodiment, the opening tools can be moved and the at least one stack can be arranged in a stationary manner.
    The two opening tools are explained in more detail with reference to FIGS. 31 and 32, one of which is arranged in one of the two arms 112 which can be pivoted parallel to the plane of the wafer. As can be seen in particular from FIG. 32, each opening tool 114 has a lower and an upper gripping part 116, 117. The upper gripping part 117 is formed here with a plurality of gripping elements 117 'arranged one above the other. Successive gripping elements 117 'form a groove 118 between them, the groove width of which is greater than the height of the bearing rings 10 also shown in a perspective detail in FIG. 33 in the area of their outer circumference. Since the spacing of successive grooves 118 corresponds to the spacing of successive storage rings 10, a storage ring with a portion of its circumferential area can be arranged in each groove 118.
    The lower gripping part 116 is designed in basically the same way, while a middle gripping part 119 only has a stepped support surface.
    If it is now possible to access a specific storage ring 10 for removing or inserting a wafer, all stacks 12 (FIG. 29) are first moved together in the Z direction. As a result, the storage ring 10b provided for access is brought in the Z direction to the same position in which the middle gripping part 119 is also located. The two arms 112 can then be swiveled towards the stack 12, so that the bearing ring 10b is located with a circumferential section directly above the support surface of the central gripping part 119. Storage rings 10 following this storage ring 10b upwards are arranged in the grooves of the upper gripping part, while storage rings 10 following downwards are located in grooves of the lower gripping part 116.
    If a storage ring 10 is to be accessed which is located in the area of the base plate 111, the base plate 111 itself can also be arranged with its webs in the lower gripping part 116, as shown in FIG. 32. The same applies to the upper gripping part 117 and the cover plate 112, which is also provided with corresponding webs on its circumference.
    To generate an access distance between two successive storage rings, the relative movement required for this can only be placed in the stack, only in the opening tool or a partial movement in each case both in the stack and in the opening tool. In one of these possible configurations, the upper gripping part 117 is lowered by a predetermined small distance S1 in the Z direction upwards and the lower gripping part 116 is lowered by a predetermined distance S2 downward. The amount of the path S1 can be greater than the amount of the path S2. The middle gripping part 119, on the other hand, can remain in its original Z position. As a result, a situation as shown in Fig. 32 arises. The wafer to be removed now has a sufficient distance to the next higher storage ring 10 as well as to the next lower wafer for handling by an automatic handling device. The next lower wafer can now be located approximately in the plane of the storage ring 10b, the wafer of which is being accessed.
    Since the release or separation of storage rings 10 and their wafers essentially only depends on a relative movement between the storage ring 10b to be released and the above - and / or possibly also below it - arranged storage ring, further possible movement distributions are explained below . The relative movement (s) can of course also be generated in other ways than shown here.
    For example, it is possible that the sub-stack 12 ', which is arranged above the storage ring 10b, to be accessed (upper sub-stack) is only held in its current Z position during the separation process. The distance to the upper partial stack 12 'is generated by a downward movement of the central gripping part 119 - and thus also of the bearing ring 10b - and the lower partial stack 12 "arranged below it in the Z direction The lower partial stack 12 ″ arranged below the bearing ring 10b, however, can continue this movement by means of the lower gripping part 116 until the lower gripping part 116 also strikes a stop or stops its movement in some other way. As a result, there is also sufficient space below the substrate 121 arranged on the storage ring 10b in order to move a gripper between the substrate 121 and the storage ring 10b.
    In another embodiment, the upper partial stack 12 'is again held in its Z position by the upper gripping part 117 in a fixed position. The access space is created by a downward movement of the remaining storage elements 10 in the Z direction, in which, for example, the base plate 111 is moved downward. By delimiting the travel paths of the storage ring and the lower partial stack differently, a distance can also be created between them.
    All movements directed downwards or upwards in the Z direction can be carried out wholly or in part by utilizing the force of gravity and / or by drive means such as hydraulic, pneumatic, electrical and resilient drive means. Such drive means also enable a functionally reliable closure of the storage device after access to one of the storage elements.
    From FIGS. 33 and 34 further details of the bearing rings 10 preferably used in connection with these exemplary embodiments according to the invention can be seen. Accordingly, the bearing rings are only approximately circular. Rather, they have four sections 122 which are offset by 90 ° from one another and run essentially in a straight line. The straight course makes it possible to arrange these sections with a larger contact surface in the grooves of the gripping parts or on their bearing surfaces.
    In addition, the bearing rings have a plurality of centering domes 123, which serve to enable the bearing rings 10 to be stacked on top of one another as precisely as possible. Here, the centering domes 123 engage in the respective centering domes 123 of a storage ring 10 adjacent in the stacking direction. The centering domes 123 make it possible to avoid means which would otherwise be required in addition to the bearing rings for their exact alignment with one another or with respect to the base plate 111.
    Within the stack composed of at least the bearing rings 10, the lower base plate 111 and the end cover 110, clean room conditions can be created, as is indicated in FIG. 30. The means provided for this purpose for creating clean room conditions are not shown in more detail. These means can be used to create an atmosphere that is under increased pressure in relation to the surroundings, for example a nitrogen or ultra-pure air atmosphere. With predetermined leaks in the stack, a targeted outflow of the respective gas from the interior of the stack can be achieved and the penetration of particles from the outside into the interior of the container can be avoided. These leaks can be achieved, for example, by omitting a seal or by an incomplete seal between the bearing rings.
    35 shows a transport container 200 according to the invention, which is composed of storage rings 10 arranged one above the other and directly on top of one another, a base plate 211 and a cover 210. Since the storage rings again have sealing elements (not shown, but preferably provided), they form, together with the end cover and the base plate, a sealed transport container 200 for substrates. The transport container 200 can be secured against unintentional opening by means of closure means, for example two clamps (not shown in more detail), which each encompass both the cover 210 and the base plate 211. Successive storage rings 10 can be mutually articulated in advantageous developments of the invention in ways not shown. In this way, an increase in the distance between the mounting elements 10 can be achieved in a particularly simple manner and, at the same time, cohesion between the mounting elements can be created. Such a linkage can, for example, be a type of scissor linkage.
    In a further development of the transport container according to the invention, it can also be provided that the transport container 200 shown is inserted into an outer lockable transport box. In this case, the seals against external influences can take place through the outer transport box.
    权利要求:
    Claims (10)
    [1]
    1. A device for storing plate-shaped substrates, in particular wafers (40) or test wafers, as occur above all in the manufacture of electronic components, the device• has a plurality of storage elements (10) following one another in a stacking direction, each of which is provided for receiving at least one substrate,• the storage elements (10) are each provided with means for supporting the at least one substrate,• the storage elements (10) each have a stacking area which is provided for the arrangement of the respective storage element within a stack (12) of storage elements (10), and• the storage elements (10) can be stacked directly on top of one another.
    [2]
    2. Device according to claim 1, characterized in that the storage elements (10) for generating an enlarged distance between two successive storage elements (10) are provided with means by which they can be handled in their stacking area, whereby one of the storage elements (10) for a storage or removal of one of the substrates mentioned becomes accessible.
    [3]
    3. Device according to one of the preceding claims, characterized in that means for executing a relative movement between two successive bearing elements (10) are provided in order to generate an enlarged distance.
    [4]
    4. Device according to one of the preceding claims, characterized in that the storage elements (10) are designed as at least approximately self-contained storage rings (10).
    [5]
    5. Device according to one of the preceding claims, characterized in that the storage elements (10) arranged on top of one another form an at least laterally, preferably completely, closed space.
    [6]
    6. The device according to claim 5, characterized by means for generating clean air with which a clean room atmosphere can be generated in the closed space, in particular a clean room atmosphere with an overpressure inside the room.
    [7]
    7. Device according to one of the preceding claims, characterized by at least one centering means formed on one of the storage elements (10), which in each case interacts with a centering means of a storage element (10) following in the stacking direction to increase the stability against tipping.
    [8]
    8. Device according to one of the preceding claims 3 to 7, characterized by a tool (50, 114) of the means for generating a relative movement between two consecutive bearing elements (10), which has a first contact surface for contacting an upper bearing element (10) , as well as a second contact surface for contacting a lower bearing element (10), wherein movement means are provided with which the relative movement between at least one of the bearing elements (10) and at least one of the contact surfaces can be carried out to a distance between the bearing elements (10) to enlarge.
    [9]
    9. Transport container for transporting substrates in a closed room, characterized by a device according to claim 1 or 2, and by a base plate (211) and a cover (210) between which the storage elements (10) are arranged, the transport container by means of closure means (200) can be secured against unintentional opening.
    [10]
    10. The method for operating the device according to claim 8, in which, for handling a disk-shaped substrate, in particular a wafer (40) such as is provided for the production of semiconductor components, for approaching a tool (50, 114) which has two contact surfaces, a first relative movement is carried out on a certain storage element (10) within a stack (12) of separable storage elements (10), the certain storage element is contacted with the first contact surface and an adjacent storage element (10) is contacted with the second contact surface, followed by a second Relative movement is carried out by means of which the tool (50, 114) increases a distance between the two storage elements (10) in the stacking direction.
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    同族专利:
    公开号 | 公开日
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    优先权:
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    CH12192003|2003-07-11|JP2006519739A| JP4751827B2|2003-07-11|2004-07-08|Equipment for storing or transporting a substrate and method using the same|
    US10/564,066| US7682455B2|2003-07-11|2004-07-08|Device for storing and/or transporting plate-shaped substrates in the manufacture of electronic components|
    KR1020067000678A| KR101229132B1|2003-07-11|2004-07-08|Device for storing and/or transporting plate-shaped substrates in the manufacture of electronic components|
    PCT/CH2004/000428| WO2005006407A1|2003-07-11|2004-07-08|Device for storing and/or transporting plate-shaped substrates in the manufacture of electronic components|
    EP04738069.6A| EP1644959B1|2003-07-11|2004-07-08|Device for storing and/or transporting plate-shaped substrates in the manufacture of electronic components|
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